세미나

Metrology, or the science of measurement, is essential in all manufacturing fields. The phrase “if it can’t be measured, it can’t be manufactured” may be overused, but it remains true. Once a workpiece is machined, its dimensions need to be inspected for quality control. There is a critical need for online, fast, reliable dimensional metrology not only in metal cutting processes, but also in semiconductor manufacturing processes. In particular, integration of metrology and inspection in their manufacturing and electronics packaging processes is becoming increasingly important as the critical dimension (CD) reduces to a few nanometer scales. Investigator Lee has extensively researched a variety of precision optical metrology and inspection methods and their systems and has used theoretical approaches of optical sensors and instrumentation, primarily focused on surface topography characterization. Lee aims to seek the possibilities of transformative methods by elaborating on integration of metrology and inspection in advanced electronics packaging processes. In the invited talk, novel dimensional measurement techniques that can be used for advanced electronics manufacturing and packaging processes, primarily focused on via defectivity metrology and inspection will be introduced. The invited talk includes novel technology about metrology and inspection of wafers, bonded wafers, masks, vias, etc. Then, the future research for potential collaboration with the attendants will be briefly introduced. This research addresses the metrology needs of industries and national science initiatives for advanced semiconductor manufacturing.